Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity
Born, V., Beck, M., Bosholm, O., Dalleau, D., Glenz, S., Haverkamp, I., … Vest, A. (2009). Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity. Microelectronics Reliability, 49. http://doi.org/https://doi.org/10.1016/j.microrel.2008.10.017