TY - JOUR
AU - V. Born
AU - M. Beck
AU - O. Bosholm
AU - D. Dalleau
AU - S. Glenz
AU - I. Haverkamp
AU - G. Kurz
AU - F. Lange
AU - Anja Vest
BT - Microelectronics Reliability
DO - https://doi.org/10.1016/j.microrel.2008.10.017
M1 - 1
M3 - Journal Article
PY - 2009
T2 - Microelectronics Reliability
TI - Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity
UR - https://www.sciencedirect.com/science/article/pii/S0026271408004083
VL - 49
SN - 0026-2714
ER -