Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity

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1.
Born V, Beck M, Bosholm O, u. a. Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity. Microelectronics Reliability. 2009;49. doi:https://doi.org/10.1016/j.microrel.2008.10.017.

Details

  • Volume

    49

  • Type of Article

    Journal Article

  • ISSN Number

    0026-2714

  • URL

    https://www.sciencedirect.com/science/article/pii/S0026271408004083