Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity
Born, V. ., Beck, M. ., Bosholm, O. ., Dalleau, D. ., Glenz, S. ., Haverkamp, I. ., … Vest, A. . (2009). Extended metallization reliability testing: Combining standard wafer level with product tests to increase test sensitivity. Microelectronics Reliability, 49. http://doi.org/https://doi.org/10.1016/j.microrel.2008.10.017